[學習] Wafer

 

覆晶技術與晶圓級晶方尺度構裝技術

https://www.materialsnet.com.tw/DocDnld.aspx?id=2146 

 

[Eng Sub] Wafer Bumping Process: Solder bump, Cu pillar bump, UBM

https://www.youtube.com/watch?v=VLwqssWjRMU 

Overview of Copper Pillar Technology

https://www.youtube.com/watch?v=pigf04h7PEY